Views: 0 Author: Site Editor Publish Time: 2026-10-29 Origin: Site
Event Details:
Exhibition: LOUPE India 2026 (formerly Labelexpo)
Exhibitor: Fujian Cheshire New Material Group Co., Ltd.
Date: October 29 - November 1 , 2026
Location: India Expo Centre & MartGreater Noida, Delhi NCR
Booth: Hall 10, G2
Featured Technology: SBC-Based Hot Melt Pressure Sensitive Adhesives (HMPSA)
Cheshire has successfully concluded its showcase at LOUPE India 2026 (formerly Labelexpo). As one of South Asia’s prominent trade exhibitions for label printing, packaging, and converting technologies, the event provided an excellent platform for Cheshire to connect with regional industry leaders and technical decision-makers.
Throughout the exhibition, our technical and sales delegation conducted extensive on-site consultations with converters, label manufacturers, and industrial packaging specialists across India and the surrounding regions.
Guided by our core brand promise — "Each piece of adhesive contains a promise to you" — Cheshire presented our high-performance SBC-Based Hot Melt Adhesives specifically optimized for challenging application environments:
Self-Adhesive Labeling Solutions: High-tack HMPSA formulations engineered for paper, clear film, and thermal labels with excellent die-cutting capabilities and bleed resistance.
E-Commerce & Courier Bag Packaging: Heavy-duty flap sealing adhesives featuring strong initial tack and destructive bonding performance across wide temperature ranges.
Hygiene & Specialty Converting: Specialized hot melt solutions tailored for non-woven lamination, hygiene products, and double-sided tape manufacturing.
Our engineering team is actively processing the inquiries and sample requests gathered during LOUPE India 2026. If you met our team in India or need further technical documentation (TDS/SDS), trial samples, or customized formulation discussions, our team is ready to assist.
