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Cheshire at Index 2026 Geneva: Engineering the Future of Hot Melt Adhesive Solutions

Views: 0     Author: Jason D.     Publish Time: 2026-05-19      Origin: Site

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  • Event Name: Index 2026 (The World's Leading Nonwovens Exhibition)

  • Date: May 19 – May 22, 2026

  • Location: Palexpo, Geneva, Switzerland

  • Cheshire Booth: Booth 4287

As a premier, tech-driven hot melt adhesive manufacturer, Cheshire is dedicated to helping global B2B clients optimize their automated production lines, reduce downtime, and achieve flawless product integrity. Index 2026 represents the perfect milestone to unveil our next-generation industrial adhesives, specifically engineered to match the rigorous demands of modern manufacturing.

What to Expect from Cheshire at Index 2026?

At our Geneva exhibit, our senior international engineering matrix and polymer chemists will introduce bespoke bonding solutions focusing on three core industrial pillars:

  • Eco-Compliance & Safety: Discover our full range of adhesives that clear rigorous SGS audits and full EU RoHS/REACH compliance standards, ensuring safe market readiness for international export.

  • Advanced Rheology & Processing: Explore formulations optimized for clean, high-speed automated spraying and nozzle application without clogging or stringing.

  • Premium Performance Defying Heat & Moisture: Witness our latest polymers that maintain high destructive peel strength and flexible structural integrity across extreme temperature gradients.

Schedule an On-Site Technical Consultation

We understand that choosing the right hot melt adhesive supplier requires technical alignment. Our specialized field technical support squads will be available throughout the 4-day exhibition to deliver face-to-face consultancy, analyze your specific substrate materials, and discuss custom formula adjustments tailored to your machinery.

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Contact Us

 Landline Phone: +86-592-5280283
 Email: info@qx-hotmelt.com
 Address: No. 7 Fangtang West Road, Guankou Town, Jimei District, Xiamen, Fujian, China
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